Electronic component

ABSTRACT

An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority to Japanese PatentApplication No. 2018-192869 filed on Oct. 11, 2018 and Japanese PatentApplication No. 2019-144855 filed on Aug. 6, 2019. The entire contentsof these applications are hereby incorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to an electronic component.

2. Description of the Related Art

A known electronic component includes a multilayer body in which innerelectrodes and dielectric layers are alternately stacked, and an outerelectrode that is electrically connected to the inner electrodes andthat is formed on a surface of the multilayer body.

Such an electronic component disclosed in Japanese Unexamined PatentApplication Publication No. 2016-86118 is a multilayer ceramic capacitorincluding outer electrodes that are disposed on both end surfaces of amultilayer body and outer terminals that are disposed on both sidesurfaces thereof. In the multilayer ceramic capacitor, signal innerelectrodes that are extended to the end surfaces of the multilayer bodyand ground inner electrodes that are extended to the side surfaces ofthe multilayer body are alternately stacked with dielectric layersinterposed therebetween. The outer electrodes that are disposed on theend surfaces of the multilayer body are electrically connected to thesignal inner electrodes. Ground outer terminals that are disposed on theside surfaces of the multilayer body are electrically connected to theground inner electrodes.

However, the multilayer ceramic capacitor disclosed in JapaneseUnexamined Patent Application Publication No. 2016-86118 has a problemin that the size of an effective region in which each signal innerelectrode and the corresponding ground inner electrode overlap in astacking direction decreases because portions of the ground innerelectrode are extended to the side surfaces of the multilayer body, andan electrostatic capacity decreases accordingly.

SUMMARY OF THE INVENTION

Preferred embodiments of the present invention provide electroniccomponents that each include outer electrodes on side surfaces of amultilayer body and that enables an effective region in which innerelectrodes overlap in the stacking direction to be enlarged.

According to a preferred embodiment of the present invention, anelectronic component includes a multilayer body in which a plurality ofinner electrodes and a plurality of dielectric layers are alternatelystacked, and a plurality of outer electrodes that are electricallyconnected to the plurality of inner electrodes. The multilayer bodyincludes a first main surface and a second main surface that areopposite to each other in a stacking direction, a first side surface anda second side surface that are opposite to each other in a widthdirection perpendicular or substantially perpendicular to the stackingdirection, and a first end surface and a second end surface that areopposite to each other in a length direction perpendicular orsubstantially perpendicular to the stacking direction and the widthdirection. At least one of the plurality of outer electrodes is locatedon at least one of the first side surface or the second side surface ofthe multilayer body and is directly connected to the plurality of innerelectrodes at positions spaced away from the at least one of the firstside surface or the second side surface toward an inside of themultilayer body.

The multilayer body may include a margin portion in which the pluralityof inner electrodes are not present when a section of the multilayerbody including the length direction and the width direction is viewed inthe stacking direction. Each of the plurality of outer electrodes mayinclude a through section that extends through the margin portion and isdirectly connected to the plurality of inner electrodes by the throughsection.

The multilayer body may include an outer layer portion in which theplurality of inner electrodes are not present except for the marginportion when a section of the multilayer body including the widthdirection and the stacking direction is viewed in the length direction.Each of the plurality of outer electrodes may include the throughsection also at a height position in the stacking direction at which theouter layer portion is located.

The plurality of outer electrodes may be located on at least one of thefirst side surface and the second side surface.

The plurality of inner electrodes may include a first inner electrodeand a second inner electrode. The plurality of outer electrodes mayinclude at least one first outer electrode that is located on at leastone of the first end surface or the second end surface of the multilayerbody and that is connected to the first inner electrode, and at leastone second outer electrode that is located on at least one of the firstside surface or the second side surface of the multilayer body and thatis connected to the second inner electrode. The second inner electrodeis preferably not in contact with the at least one of the first endsurface or the second end surface of the multilayer body on which the atleast one first outer electrode is located. The first inner electrodemay include a notch that overlaps, in the stacking direction, aconnection between the second inner electrode and the at least onesecond outer electrode.

A dimension of the margin portion in the width direction may be no lessthan about 5 μm and no more than about 30 μm.

The margin portion may include margin layers that are stacked in thewidth direction.

The second inner electrode may include Si and Ti. A mole ratio of Si toTi included in an end portion of the second inner electrode in the widthdirection may be larger than that in a central portion of the secondinner electrode in the width direction.

The plurality of outer electrodes and the plurality of inner electrodesmay include a common material including a dielectric material, and anamount of the common material that is included in the plurality of outerelectrodes may be larger than an amount of the common material that isincluded in the plurality of inner electrodes.

An average particle diameter of a dielectric particle that is includedin the plurality of dielectric layers that are located between theplurality of inner electrodes may be larger than an average particlediameter of a dielectric particle that is included in the marginportion.

A dimension, in the width direction, of one of the plurality of innerelectrodes that is located at a central portion in the stackingdirection may be larger than a dimension, in the width direction, ofanother inner electrode that is located at an outer portion in thestacking direction.

According to preferred embodiments of the present invention, at leastone of the plurality of outer electrodes is located on at least one ofthe first side surface or the second side surface of the multilayer bodyand is directly connected to the plurality of inner electrodes atpositions spaced away from the at least one of the first side surface orthe second side surface toward the inside of the multilayer body. Thatis, it is not necessary for the plurality of inner electrodes to includeextended portions that protrude in the width direction for connection tothe at least one of the plurality of outer electrodes. Accordingly, aneffective region in which the plurality of inner electrodes overlap inthe stacking direction can be enlarged, and characteristics of theelectronic component can be significantly improved.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an example of a multilayer ceramiccapacitor according to a preferred embodiment of the present invention.

FIG. 2 is a sectional view of the multilayer ceramic capacitor shown inFIG. 1 taken along line II-II.

FIG. 3 is a sectional view of the multilayer ceramic capacitor shown inFIG. 1 taken along line III-III.

FIG. 4A is a plan view of a first inner electrode and a dielectriclayer.

FIG. 4B is a plan view of a second inner electrode and a dielectriclayer.

FIG. 5 is a sectional view of the multilayer ceramic capacitor that hasa structure in which end portions, in the width direction, of an innerelectrode that is located at a central portion in a stacking directionprotrude outward more than end portions of other inner electrodes atouter portions in the stacking direction.

FIG. 6A is a sectional view of the multilayer ceramic capacitor takenalong a plane including a first inner electrode.

FIG. 6B is a sectional view thereof taken along a plane including asecond inner electrode.

FIG. 7 is a sectional view of the multilayer ceramic capacitor takenalong a plane including an outer layer portion.

FIG. 8A is a sectional view of a multilayer ceramic capacitor accordingto a preferred embodiment of the present invention in which two firstouter electrodes are disposed on a first side surface of the multilayerbody, and two second outer electrodes are disposed on a second sidesurface, taken along a plane including two first inner electrodes.

FIG. 8B is a sectional view thereof taken along a plane including twosecond inner electrodes.

FIG. 9A is a sectional view of a multilayer ceramic capacitor accordingto a preferred embodiment of the present invention in which two firstouter electrodes and two second outer electrodes are disposed on thefirst side surface, and two first outer electrodes and two second outerelectrodes are disposed on the second side surface of the multilayerbody, taken along a plane including a first inner electrode.

FIG. 9B is a sectional view thereof taken along a plane including asecond inner electrode.

FIG. 10A is a sectional view of a multilayer ceramic capacitor accordingto a preferred embodiment of the present invention in which first outerelectrodes and second outer electrodes are alternately disposed on thefirst side surface, the second side surface, a first end surface, and asecond end surface of the multilayer body, taken along a plane includinga first inner electrode.

FIG. 10B is a sectional view thereof taken along a plane including asecond inner electrode.

FIG. 11A is a sectional view of a multilayer ceramic capacitor accordingto a preferred embodiment of the present invention in which first outerelectrodes and a second outer electrode are disposed on only the firstside surface of the multilayer body, taken along a plane including afirst inner electrode.

FIG. 11B is a sectional view thereof taken along a plane including asecond inner electrode.

FIG. 12A is a sectional view of a multilayer ceramic capacitor accordingto a preferred embodiment of the present invention in which first outerelectrodes are disposed on the first side surface, the second sidesurface, the first end surface, and the second end surface of themultilayer body, and second outer electrodes are disposed on the firstside surface and the second side surface, taken along a plane includinga first inner electrode.

FIG. 12B is a sectional view thereof taken along a plane including asecond inner electrode.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Preferred embodiments of the present invention will hereinafter bedescribed in detail with reference to the drawings. In the followingdescription, an example of an electronic component according to thepresent invention is a multilayer ceramic capacitor. The electroniccomponent, however, is not limited to the multilayer ceramic capacitorand may be another electronic component, such as an inductor or a LCfilter, for example.

FIG. 1 is a perspective view of an example of a multilayer ceramiccapacitor 10 according to a preferred embodiment of the presentinvention. FIG. 2 is a sectional view of the multilayer ceramiccapacitor 10 shown in FIG. 1 taken along line II-II. FIG. 3 is asectional view of the multilayer ceramic capacitor 10 shown in FIG. 1taken along line III-III.

As shown in FIG. 1 to FIG. 3, the multilayer ceramic capacitor 10preferably has a rectangular or substantially rectangular cuboid shapeoverall and includes a multilayer body 11 and outer electrodes 1 and 2that are disposed on surfaces of the multilayer body 11.

The multilayer body 11 includes a first end surface 15 a and a secondend surface 15 b that are opposite to each other in a length directionL, a first main surface 16 a and a second main surface 16 b that areopposite to each other in a stacking direction T, and a first sidesurface 17 a and a second side surface 17 b that are opposite to eachother in a width direction W.

The first end surface 15 a and the second end surface 15 b extend in thewidth direction W and the stacking direction T. The first main surface16 a and the second main surface 16 b extend in the length direction Land the width direction W. The first side surface 17 a and the secondside surface 17 b extend in the length direction L and the stackingdirection T.

The outer electrodes 1 and 2 include first outer electrodes 1 and secondouter electrodes 2. According to the preferred embodiment, as shown inFIG. 1, two of the first outer electrodes 1 are disposed on the firstend surface 15 a and the second end surface 15 b that are opposite toeach other, and two of the second outer electrodes 2 are disposed on thefirst side surface 17 a and the second side surface 17 b that areopposite to each other.

Here, a direction in which the two first outer electrodes 1 are oppositeto each other is defined as the length direction L of the multilayerceramic capacitor 10, and a direction in which first inner electrodes 13a and second inner electrodes 13 b, which are inner electrodes 13described later, are stacked is defined as the stacking direction T, anda direction perpendicular or substantially perpendicular to the lengthdirection L and the stacking direction T is defined as the widthdirection W.

Regarding the size of the multilayer ceramic capacitor 10, for example,a dimension in the length direction L is preferably no less than about0.2 mm and no more than about 3.2 mm, a dimension in the width directionW is no less than about 0.1 mm and no more than about 1.6 mm, and adimension in the stacking direction T is no less than about 0.1 mm andno more than about 1.6 mm. The dimensions may have a tolerance of about±10%. The relationship of magnitude among the dimension in the widthdirection W, the dimension in the length direction L, and the dimensionin the stacking direction T of the multilayer ceramic capacitor 10 doesnot depend on the relationship of magnitude of the dimensions accordingto the preferred embodiment. For example, the dimension in the widthdirection W may be larger than the dimension in the length direction L.

The multilayer body 11 includes rounded corner portions and roundedridge portions. Three surfaces of the multilayer body 11 intersect eachother at the corner portions. Two surfaces of the multilayer body 11intersect each other along the ridge portions.

As shown in FIG. 2 and FIG. 3, the multilayer body 11 includes an innerlayer portion 21, outer layer portions 22, and margin portions 23.

The inner layer portion 21 includes dielectric layers 12, the firstinner electrodes 13 a, and the second inner electrodes 13 b. Thedielectric layers 12, the first inner electrodes 13 a, and the secondinner electrodes 13 b extend in the width direction W and the lengthdirection L.

The dielectric layers 12 are interposed between the first innerelectrodes 13 a and the second inner electrodes 13 b. The first innerelectrodes 13 a and the second inner electrodes 13 b are alternatelystacked with the dielectric layers 12 interposed therebetween, andconsequently, the inner layer portion 21 is defined.

Each dielectric layer 12 preferably includes, for example, dielectricceramic particles each of which has a perovskite structure and includesa perovskite compound including Ba and Ti as a main component. The maincomponent may include an additive of at least one of Si, Mg, Mn, or Ba,for example. The dielectric layer 12 may include a rare-earth elementsuch as Dy, Y, or Ho, for example. The thickness of the dielectric layer12 is preferably, for example, no less than about 0.3 μm and no morethan about 1.0 μm.

The first inner electrodes 13 a and the second inner electrodes 13 bface each other in the stacking direction T with the dielectric layers12 interposed therebetween. An electrostatic capacity is generated inregions in which the first inner electrodes 13 a and the second innerelectrodes 13 b face each other with the dielectric layers 12 interposedtherebetween.

FIG. 4A is a plan view of one of the dielectric layers 12 on which thecorresponding first inner electrode 13 a is provided. FIG. 4B is a planview of one of the dielectric layers 12 on which the correspondingsecond inner electrode 13 b is provided.

As shown in FIG. 4A, each first inner electrode 13 a includes notches 40at central portions in the length direction L and along both of edges inthe width direction W. That is, the first inner electrode 13 a has asize smaller than that of each dielectric layer 12 due to the notches40.

The first inner electrodes 13 a extend in the length direction L to thefirst end surface 15 a and the second end surface 15 b of the multilayerbody 11. The first inner electrodes 13 a extend in the width direction Wand are in contact with the margin portions 23 described later exceptfor the notches 40.

The second inner electrodes 13 b are not in contact with the first endsurface 15 a and the second end surface 15 b on which the first outerelectrodes 1 are disposed. That is, as shown in FIG. 4B, the secondinner electrodes 13 b extend in the width direction W and are in contactwith the margin portions 23 described later but do not extend in thelength direction L to the first end surface 15 a and the second endsurface 15 b of the multilayer body 11. Accordingly, when the size ofeach dielectric layer 12 is considered as a standard, end portions ofthe second inner electrodes 13 b in the length direction L are located apredetermined distance inward from the first end surface 15 a and thesecond end surface 15 b in the length direction L.

The second inner electrodes 13 b are connected to the second outerelectrodes 2 that are disposed on the first side surface 17 a and thesecond side surface 17 b of the multilayer body as described later butinclude no extended portions that protrude in the width direction W forconnection to the second outer electrodes 2 as shown in FIG. 4B. Asshown in FIGS. 4A and 4B, the maximum dimension of each second innerelectrode 13 b in the width direction W is preferably equal orsubstantially equal to the maximum dimension of each first innerelectrode 13 a in the width direction W.

The first inner electrodes 13 a and the second inner electrodes 13 bpreferably include, for example, Ni. The first inner electrodes 13 a andthe second inner electrodes 13 b may include, for example, a metal suchas Cu, Ag, Pd, an Ag—Pd alloy, or Au other than Ni. The first innerelectrodes 13 a and the second inner electrodes 13 b preferably include,for example, a common material that is the same or substantially thesame dielectric material as dielectric ceramics that is included in thedielectric layers 12.

The first inner electrodes 13 a and the second inner electrodes 13 bpreferably include, for example, Si and Ti. The mole ratio of Si to Tiincluded in end portions, in the width direction W, of the second innerelectrodes 13 b that have a uniform dimension in the width direction Wis larger than that in central portions of the second inner electrodes13 b in the width direction W. That is, Si is segregated in the endportions of the second inner electrodes 13 b in the width direction W.Similarly, Si is segregated in end portions of the first innerelectrodes 13 a in the width direction W.

The amounts of Ti and Si that are included in the second innerelectrodes 13 b can be obtained, for example, by awave-length-dispersive X-ray spectroscopy (WDX) after the multilayerceramic capacitor 10 is polished to expose the second inner electrodes13 b.

The number of the inner electrodes 13 that are stacked and that includethe first inner electrodes 13 a and the second inner electrodes 13 b ispreferably, for example, no less than 20 and no more than 500. Thethickness of each of the first inner electrodes 13 a and the secondinner electrodes 13 b is preferably, for example, no less than about 0.1μm and no more than about 0.8 μm.

According to the present preferred embodiment, as shown in FIG. 3, theend portions of the inner electrodes 13 are aligned in the stackingdirection when a section of the multilayer ceramic capacitor 10 havingthe width direction W and the stacking direction T is viewed in thelength direction L. That is, the dimensions of the inner electrodes 13in the width direction W are equal or substantially equal to each other.

As shown in FIG. 5, the end portions of the inner electrode 13 in thewidth direction W at a central portion in the stacking direction T mayprotrude outward more than the end portions at outer portions in thestacking direction T. In other words, the dimensions, in the widthdirection W, of the inner electrodes 13 that are located at the outerportions in the stacking direction T are smaller than the dimension, inthe width direction W, of the inner electrode 13 that is located at thecentral portion in the stacking direction T. A decrease in thedimensions, in the width direction W, of the inner electrodes 13 thatare located at the outer portions in the stacking direction T enablesdistances from the ridge portions to the inner electrodes to beincreased, and humidity resistance against water that enters from theridge portions can be significantly improved.

For example, the dimensions of the inner electrodes 13 in the widthdirection W can be measured by the following method. A surface of themultilayer ceramic capacitor 10 having the width direction W and thestacking direction T is first exposed. In the following description, thesurface having the width direction W and the stacking direction T isreferred to as a WT section. Subsequently, the WT section is imaged withan optical microscope. The dimension, in the width direction W, of theinner electrode 13 that is located at the central portion in thestacking direction T and the dimensions, in the width direction W, ofthe inner electrodes 13 that are located at the outer portions in thestacking direction T are measured. The dimension, in the width directionW, of the inner electrode 13 that is located at the central portion inthe stacking direction T and the dimensions, in the width direction W,of the inner electrodes 13 that are located at the outer portions in thestacking direction T are measured by calculating average values ofmeasured values at three positions of the position of a central portionof the multilayer ceramic capacitor 10 in the length direction L, aposition nearer than the central portion to the first end surface 15 a,and a position nearer than the central portion to the second end surface15 b.

The outer layer portions 22 are disposed on both of the outsides of theinner layer portion 21 in the stacking direction T. That is, the innerlayer portion 21 is interposed between the two outer layer portions 22that are disposed on both of the outsides in the stacking direction T.In the outer layer portions 22, the first inner electrodes 13 a and thesecond inner electrodes 13 b are not present except for the marginportions 23 described later when a section of the multilayer body 11having the stacking direction T and the width direction W is viewed inthe length direction L.

Each outer layer portion 22 includes a dielectric body including, forexample, the same or substantially the same material as that of thedielectric layers 12. A different dielectric material is alsoacceptable. The dimension of the outer layer portion 22 in the stackingdirection T is preferably, for example, about 10 μm or more.

In the margin portions 23, the first inner electrodes 13 a and thesecond inner electrodes 13 b are not present when a section of themultilayer body 11 having the length direction L and the width directionW is viewed in the stacking direction T. As shown in FIG. 3, the marginportions 23 are located on both of the outsides in the width directionW. That is, the inner layer portion 21 and the outer layer portions 22are located between the two margin portions 23, which are provided atboth of the outsides of the inner layer portion 21 and the outer layerportions 22 in the width direction W. According to the present preferredembodiment, the margin portions 23 are located on both of the outsidesin the width direction W but may be disposed on both of the outsides inthe length direction L, that is, near the first end surface 15 a and thesecond end surface 15 b.

According to the present preferred embodiment, each margin portion 23includes margin layers that are stacked in the width direction W.Specifically, the margin portion 23 includes an outer margin layer 23 aand an inner margin layer 23 b. The outer margin layer 23 a is locatednear the first side surface 17 a or the second side surface 17 b of themultilayer body 11. The inner margin layer 23 b is located near theinner layer portion 21, that is, at a position nearer than the outermargin layer 23 a to the inside in the width direction W.

When each margin portion 23 includes the margin layers 23 a and 23 b,boundaries therebetween can be readily checked by observing differencesin sinterability between the outer margin layer 23 a and the innermargin layer 23 b with an optical microscope. That is, there is aboundary line between the outer margin layer 23 a and the inner marginlayer 23 b.

The dimension of each margin portion 23 in the width direction W ispreferably, for example, no less than about 5 μm and no more than about100 μm. According to the present preferred embodiment, the dimension ofthe outer margin layer 23 a in the width direction W is larger than thedimension of the inner margin layer 23 b in the width direction W.

The dimension of each margin portion 23 in the width direction W refersto an average dimension that is calculated on the basis of measuredvalues of the dimension of the margin portion 23 at positions in thestacking direction T. A method of measuring the dimension of the marginportion 23 in the width direction W is as follows.

A WT section of the multilayer ceramic capacitor 10 having the widthdirection W and the stacking direction T is first exposed. Subsequently,an optical microscope images with the end portions of the first innerelectrodes 13 a and the second inner electrodes 13 b in the widthdirection W in the WT section within the same or substantially the samefield of view as a corresponding one of the two margin portions 23 thatare located on both of the outsides in the width direction W. Threeportions of an upper portion, a central portion, and a lower portion inthe stacking direction T are imaged. Parallel lines in the widthdirection W are drawn on the upper portion, the central portion, and thelower portion from the end portions of the first inner electrodes 13 aand the second inner electrodes 13 b in the width direction W toward thefirst side surface 17 a or the second side surface 17 b, and the lengthsof the lines are measured. The average values of the measured lengths ofthe lines are calculated for the upper portion, the central portion, andthe lower portion. The average values are averaged to obtain thedimension of the margin portion 23 in the width direction W.

Each margin portion 23 includes a dielectric body preferably including,for example, a dielectric ceramic material that includes BaTiO₃ as amain component and that has a perovskite structure. The main componentpreferably includes an additive of Si, for example.

The average particle diameter of the dielectric particles that areincluded in the dielectric layers 12 that are interposed between thefirst inner electrodes 13 a and the second inner electrodes 13 b islarger than the average particle diameter of the dielectric particlesthat are included in the margin portions 23. The average particlediameter of the dielectric particles in a central portion of themultilayer body 11 in the width direction W and the stacking direction Tis compared with the average particle diameter of the dielectricparticles in central portions of the margin portions 23 in the widthdirection W and the stacking direction T after the multilayer body 11 ispolished up to a central portion in the length direction L. The averageparticle diameter of the dielectric particles is calculated by imagingthe exposed section with the settings of the SEM including amagnification of 5000, an acceleration voltage of about 15 kV, and afield of view of about 30 μm× about 30 μm, the circumferences of all ofthe dielectric particles are recognized by image-processing software tocalculate an area, and the area is regarded as the area of a circle. Thediameters of all of the dielectric particles that are within the rangeof the image except for a dielectric particle that is partially imagedare measured. The average value thereof is determined to be the averageparticle diameter of the dielectric particles.

The outer margin layer 23 a includes Si in an amount larger than that inthe inner margin layer 23 b. That is, the mole ratio of Si to Ti in theouter margin layer 23 a is higher than the mole ratio of Si to Ti in theinner margin layer 23 b. For example, the mole ratio of Si to Ti in theouter margin layer 23 a is preferably no less than about 3.5 and no morethan about 6.0. The mole ratio of Si to Ti in the inner margin layer ispreferably no less than about 0.02 and no more than about 3.5. The moleratio can be measured by WDX analysis or a TEM.

Since Si acts as a sintering additive, the outer margin layer 23 a thatis obtained by firing when the multilayer ceramic capacitor 10 ismanufactured has a finer structure than that of the inner margin layer23 b. Accordingly, the strength of the margin portions 23 is able to beincreased. Accordingly, the margin portions 23 are unlikely to crack andchip, and water is prevented from entering the inside.

The margin portions 23 can be formed, for example, by manufacturing amultilayer body chip that is to be the inner layer portion 21 and theouter layer portions 22 after firing, and ceramic green sheets aresubsequently attached to both of side surfaces of the multilayer bodychip and fired. Ceramic slurry that is to be the ceramic green sheetsmay be applied to both of the side surfaces.

The first outer electrodes 1 are disposed on the first end surface 15 aand the second end surface 15 b of the multilayer body 11. The firstouter electrode 1 that is disposed near the first end surface 15 a isdisposed on the entire or substantially the entire first end surface 15a and extends from the first end surface 15 a along the first mainsurface 16 a, the second main surface 16 b, the first side surface 17 a,and the second side surface 17 b. The first outer electrode 1 that isdisposed near the second end surface 15 b is disposed on the entire orsubstantially the entire second end surface 15 b and extends from thesecond end surface 15 b along the first main surface 16 a, the secondmain surface 16 b, the first side surface 17 a, and the second sidesurface 17 b.

FIG. 6A is a sectional view of the multilayer ceramic capacitor 10 takenalong a plane including one of the first inner electrodes 13 a. FIG. 6Bis a sectional view thereof taken along a plane including one of thesecond inner electrodes 13 b.

As shown in FIG. 6A, the first outer electrodes 1 are directly connectedto the first inner electrodes 13 a along the first end surface 15 a andthe second end surface 15 b of the multilayer body 11 and areelectrically connected to the first inner electrodes 13 a. As shown inFIG. 6B, the first outer electrodes 1 are not electrically connected tothe second inner electrodes 13 b.

In the specification, the outer electrodes being directly connected tothe inner electrodes indicates that the outer electrodes and the innerelectrodes are connected to each other with the outer electrodes and theinner electrodes being in contact with each other.

Each first outer electrode 1 preferably includes a metal such as, forexample, Ni, Cu, Ag, Pd, an Ag—Pd alloy, or Au. The first outerelectrode 1 preferably includes, for example, the common material thatis the same or substantially the same dielectric material as thedielectric ceramics that is included in the dielectric layers 12. Thecommon material provides a behavior of shrinkage of the first outerelectrode 1 during firing that is the same as, or similar to, a behaviorof shrinkage of the multilayer body 11 and prevents the first outerelectrode 1 from being separated from the multilayer body 11.

The second outer electrodes 2 are disposed on the first side surface 17a and the second side surface 17 b of the multilayer body 11. The secondouter electrode 2 that is disposed near the first side surface 17 a isdisposed on a central portion of the first side surface 17 a in thelength direction L and extends from the first side surface 17 a alongthe first main surface 16 a and the second main surface 16 b. The secondouter electrode 2 that is disposed near the second side surface 17 b isdisposed on a central portion of the second side surface 17 b in thelength direction L and extends from the second side surface 17 b alongthe first main surface 16 a and the second main surface 16 b.

The positions of the second outer electrodes 2 that are disposed on thefirst side surface 17 a and the second side surface 17 b are not limitedto the positions of the central portions in the length direction L.

As shown in FIGS. 6A and 6B, the second outer electrodes 2 that aredisposed on the first side surface 17 a and the second side surface 17 bof the multilayer body 11 include respective surface portions 2 a thatare located on the surfaces of the multilayer body 11 and respectivethrough sections 2 b that extend through the margin portions 23. Asshown in FIG. 6B, the through sections 2 b are located between the firstside surface 17 a or the second side surface 17 b of the multilayer body11 and the end portions of the second inner electrodes 13 b in the widthdirection W. The second outer electrodes 2 are directly connected to thesecond inner electrodes 13 b at positions spaced away from the firstside surface 17 a and the second side surface 17 b toward the inside ofthe multilayer body 11 by the through sections 2 b and are electricallyconnected to the second inner electrodes 13 b. Each through section 2 bhas a size of at least about 10 μm or more. At least the throughsections that are connected to the corresponding second inner electrodes13 b face each other in the stacking direction.

Each first inner electrode 13 a includes the notches 40 on the centralportion in the length direction L and along both of the edges in thewidth direction W, as described above. The notches 40 overlapconnections between the second inner electrodes 13 b and the secondouter electrodes 2 in the stacking direction T. As shown in FIG. 6A,both ends of the notches 40 in the length direction L are located nearerthan both ends of the through sections 2 b of the second outerelectrodes 2 in the length direction L to the outside. With thisstructure, the second outer electrodes 2 are not electrically connectedto the first inner electrodes 13 a.

FIG. 7 is a sectional view of the multilayer ceramic capacitor 10 takenalong a plane including one of the outer layer portions 22. As shown inFIG. 7, the second outer electrodes 2 include the through sections 2 bthat extend through the margin portions 23 not only at height positionsin the stacking direction T at which the second inner electrodes 13 bare disposed, but also at height positions at which the second innerelectrodes 13 b are not disposed but the outer layer portions 22 aredisposed.

That is, the through sections 2 b of the second outer electrodes 2extend through the margin portions 23 from the first main surface 16 aof the multilayer body 11 to the second main surface 16 b when viewed inthe stacking direction T.

Each second outer electrode 2 preferably includes a metal such as, forexample, Ni, Cu, Ag, Pd, an Ag—Pd alloy, or Au. The second outerelectrode 2 preferably includes, for example, the common material thatis the same or substantially the same ceramic material as the dielectricceramics that is included in the dielectric layers 12. The commonmaterial provides a behavior of shrinkage of the second outer electrode2 during firing that is the same as, or similar to, a behavior ofshrinkage of the multilayer body 11 and prevents the second outerelectrode 2 from being separated from the multilayer body 11.

The first outer electrodes 1 and the second outer electrodes 2 can beformed, for example, by being simultaneously fired together with thefirst inner electrodes 13 a and the second inner electrodes 13 b, thatis, by co-firing. In this case, the first outer electrodes 1 and thesecond outer electrodes 2 each have a structure that is formed by beingsimultaneously fired.

In the case of formation by co-firing, for example, the first innerelectrodes 13 a and the second inner electrodes 13 b can include Ni, andthe first outer electrodes 1 and the second outer electrodes 2 can alsoinclude Ni. The formation by co-firing increases the strength of jointsbetween the first inner electrodes 13 a and the first outer electrodes 1and increases the strength of joints between the second inner electrodes13 b and the second outer electrodes 2.

In the case where the first outer electrodes 1 and the second outerelectrodes 2 are formed by co-firing, the amount of the common materialthat is included in the first outer electrodes 1 and the second outerelectrodes 2 is preferably, for example, larger than the amount of thecommon material that is included in the first inner electrodes 13 a andthe second inner electrodes 13 b in order to increase the strength ofthe joints between the first outer electrodes 1 and the multilayer body11 and between the second outer electrodes 2 and the multilayer body 11.For example, the amount of the common material that is included in thefirst outer electrodes 1 and the second outer electrodes 2 by wt % ispreferably, for example, equal to or more than about 3 times the amountof the common material that is included in the first inner electrodes 13a and the second inner electrodes 13 b.

The kind of elements that are included in the first outer electrodes 1and the second outer electrodes 2 can be checked by transmissionelectron microscope-energy-dispersive X-ray spectroscopy (TEM-EDX)elemental analysis.

In the case where the first outer electrodes 1 and the second outerelectrodes 2 are formed as Ni layers, the content of a ceramic materialin each Ni layer is preferably, for example, no less than about 25 area% and no more than about 40 area %. The content of the ceramic materialin the Ni layer being about 25 area % or more indicates that the ceramicmaterial is included in a predetermined amount or more in the Ni layer.The outer electrodes 1 and 2 that include the corresponding Ni layerthat include the ceramic material in a predetermined amount or more canbe formed by simultaneously firing outer electrode paste when themultilayer body is fired. The content of the ceramic material in the Nilayer is more preferably, for example, about 40 area % or less.

The content of the ceramic material in each Ni layer is measured by thefollowing method with the wave-length-dispersive X-ray spectroscopy(WDX). A section of a central portion of the multilayer ceramiccapacitor 10 in the width direction W is first exposed. A centralportion of the Ni layer in the thickness direction in a central portionof the multilayer body 11 in the stacking direction T is enlarged to10000 times. The field of view of an enlarged region has a range ofabout 6 μm× about 8 μm. The enlarged region is mapped by WDX. An arearatio is measured from an image that is obtained by mapping.

Each first outer electrode 1 preferably, for example, includes a Nilayer 1 d, a first plating layer 1 e, a second plating layer 1 f, and athird plating layer 1 g that are provided in this order from a positionnear the first end surface 15 a or the second end surface 15 b of themultilayer body 11. Similarly, each second outer electrode 2 preferablyincludes, for example, a Ni layer 2 d, a first plating layer 2 e, asecond plating layer 2 f, and a third plating layer 2 g in this orderfrom a position near the first side surface 17 a or the second sidesurface 17 b of the multilayer body 11. The first plating layers 1 e and2 e are preferably formed, for example, by Cu plating. The secondplating layers 1 f and 2 f are preferably formed, for example, by Niplating. The third plating layers 1 g and 2 g are preferably formed, forexample, by Sn plating. Only the second plating layers 1 f and 2 f andthe third plating layers 1 g and 2 g suffice. The first outer electrode1 may include a conductive resin layer that includes conductiveparticles and resin between the Ni layer 1 d and the first plating layer1 e. Similarly, the second outer electrode 2 may include a conductiveresin layer that includes conductive particles and resin between the Nilayer 2 d and the first plating layer 2 e. Examples of the conductiveparticles include metal particles such as Cu particles, Ag particles,and Ni particles.

In the case where the second outer electrodes 2 are formed by co-firing,the boundaries between the second outer electrodes 2 and the secondinner electrodes 13 b can be checked by checking the amounts of thecommon materials that are included therein because the amount of thecommon material that is included in the second outer electrodes 2differs from the amount of the common material that is included in thesecond inner electrodes 13 b. In addition, whether the second innerelectrodes 13 b protrude outward in the width direction W and areconnected to the second outer electrodes 2, or whether the second outerelectrodes 2 extend inward in the width direction W and are connected tothe second inner electrodes 13 b can be grasped by checking theboundaries between the second outer electrodes 2 and the second innerelectrodes 13 b.

The first outer electrodes 1 and the second outer electrodes 2 can alsobe formed by firing conductive paste that is applied to the multilayerbody 11, that is, by post-firing. In the case where the first outerelectrodes 1 and the second outer electrodes 2 are formed bypost-firing, the first outer electrodes 1 and the second outerelectrodes 2 preferably includes glass in a larger amount than those inthe first inner electrodes 13 a and the second inner electrodes 13 b.Accordingly, the boundaries between the second outer electrodes 2 andthe second inner electrodes 13 b can be checked by checking the amountsof glass included in the second outer electrodes 2 and the second innerelectrodes 13 b. In addition, whether the second inner electrodes 13 bprotrude outward in the width direction W and are connected to thesecond outer electrodes 2, or whether the second outer electrodes 2extend inward in the width direction W and are connected to the secondinner electrodes 13 b can be grasped by checking the boundaries betweenthe second outer electrodes 2 and the second inner electrodes 13 b.

The outer electrode paste that forms the first outer electrodes 1 andthe second outer electrodes 2 is preferably applied, for example, by aroller in order to inhibit air to enter the inside.

In the multilayer ceramic capacitor 10 according to the presentpreferred embodiment, the second outer electrodes 2 that are disposed onthe first side surface 17 a and the second side surface 17 b of themultilayer body 11 are directly connected to the second inner electrodes13 b at positions spaced away from the first side surface 17 a and thesecond side surface 17 b toward the inside of the multilayer body 11 asdescribed above. That is, it is not necessary for the second innerelectrodes 13 b to include extended portions that protrude in the widthdirection W for connection to the second outer electrodes 2.Accordingly, effective regions in which the first inner electrodes 13 aand the second inner electrodes 13 b overlap in the stacking direction Tcan be enlarged, and the electrostatic capacity per volume can beincreased.

With the above structure, each margin portion 23 protects the effectiveregions in the width direction W, and the dimension of the marginportion 23 in the width direction can be decreased. Accordingly, thesize of the multilayer ceramic capacitor 10 can be decreased, and theESL of the multilayer ceramic capacitor 10 can be decreased.

In particular, the second outer electrodes 2 of the multilayer ceramiccapacitor 10 according to the present preferred embodiment include thethrough sections 2 b that extend through the margin portions 23 and aredirectly connected to the second inner electrodes 13 b by the throughsections 2 b. With this structure, the second inner electrodes 13 binclude no extended portions that protrude in the width direction W forconnection to the second outer electrodes 2, and the second innerelectrodes 13 b and the second outer electrodes 2 can be connected toeach other.

In a multilayer ceramic capacitor that corresponds to an electroniccomponent according to a preferred embodiment of the present invention,at least one of outer electrodes is disposed on at least one of a firstside surface or a second side surface of a multilayer body and isdirectly connected to inner electrodes at positions spaced away from theat least one of the first side surface or the second side surface towardthe inside of the multilayer body. The multilayer ceramic capacitor 10according to the preferred embodiment described above is an example ofthe multilayer ceramic capacitor that has such a structure. Anotherexample of the multilayer ceramic capacitor that has the structure of anelectronic component according to the present invention other than theabove multilayer ceramic capacitor 10 will be described below.

First Modification

In the above multilayer ceramic capacitor 10 according to the preferredembodiment, the first outer electrodes 1 are disposed on the first endsurface 15 a and the second end surface 15 b, and the second outerelectrodes 2 are disposed on the first side surface 17 a and the secondside surface 17 b. However, positions at which the first outerelectrodes 1 and the second outer electrodes 2 are disposed are notlimited to the above positions. For example, the first outer electrodes1 and the second outer electrodes 2 may be disposed on only the firstside surface 17 a and the second side surface 17 b of the multilayerbody 11.

FIG. 8A is a sectional view of a multilayer ceramic capacitor 10Aaccording to a preferred embodiment of the present invention in whichtwo of the first outer electrodes 1 are disposed on the first sidesurface 17 a of the multilayer body 11, and two of the second outerelectrodes 2 are disposed on the second side surface 17 b, taken along aplane including two of the first inner electrodes 13 a. FIG. 8B is asectional view thereof taken along a plane including two of the secondinner electrodes 13 b. In FIGS. 8A and 8B, each margin portion 23 isshown as a single layer but may include margin layers.

As shown in FIG. 8A, the first outer electrodes 1 include respectivesurface portions 1 a that are located on the surface of the multilayerbody 11 and respective through sections 1 b that extend through one ofthe margin portions 23. The first outer electrodes 1 are connected tothe first inner electrodes 13 a at the through sections 1 b but are notconnected to the second inner electrodes 13 b as shown in FIG. 8B.

As shown in FIG. 8B, the second outer electrodes 2 include respectivesurface portions 2 a that are located on the surface of the multilayerbody 11 and respective through sections 2 b that extend through theother margin portion 23. The second outer electrodes 2 are connected tothe second inner electrodes 13 b at the through sections 2 b but are notconnected to the first inner electrodes 13 a as shown in FIG. 8A.

Also in this case, the first outer electrodes 1 extend through one ofthe margin portions 23 and are directly connected to the first innerelectrodes 13 a at positions spaced away from the first side surface 17a toward the inside of the multilayer body 11, and the second outerelectrodes 2 extend through the other margin portion 23 and are directlyconnected to the second inner electrodes 13 b at positions spaced awayfrom the second side surface 17 b toward the inside of the multilayerbody 11. The first inner electrodes 13 a include no extended portionsthat protrude in the width direction W for connection to the first outerelectrodes 1. The second inner electrodes 13 b include no extendedportions that protrude in the width direction W for connection to thesecond outer electrodes 2.

Second Modification

FIG. 9A is a sectional view of a multilayer ceramic capacitor 10Baccording to a preferred embodiment of the present invention in whichtwo of the first outer electrodes 1 and two of the second outerelectrodes 2 are disposed on the first side surface 17 a and two of thefirst outer electrodes 1 and two of the second outer electrodes 2 aredisposed on the second side surface 17 b of the multilayer body 11,taken along a plane including one of the first inner electrodes 13 a.FIG. 9B is a sectional view thereof taken along a plane including one ofthe second inner electrodes 13 b. In FIGS. 9A and 9B, each marginportion 23 is shown as a single layer but may include margin layers.

As shown in FIGS. 9A and 9B, the first outer electrodes 1 include therespective surface portions 1 a that are located on the surfaces of themultilayer body 11 and the respective through sections 1 b that extendthrough the margin portions 23, and the second outer electrodes 2include the respective surface portions 2 a that are located on thesurfaces of the multilayer body 11 and the respective through sections 2b that extend through the margin portions 23.

As shown in FIG. 9A, each first inner electrode 13 a has the notches 40that overlap connections between the second inner electrodes 13 b andthe second outer electrodes 2 in the stacking direction T. As shown inFIG. 9B, each second inner electrode 13 b has the notches 40 thatoverlap connections between the first inner electrodes 13 a and thefirst outer electrodes 1 in the stacking direction T.

With the above structure, the first outer electrodes 1 are connected tothe first inner electrodes 13 a as shown in FIG. 9A but are notconnected to the second inner electrodes 13 b as shown in FIG. 9B. Thesecond outer electrodes 2 are connected to the second inner electrodes13 b as shown in FIG. 9B but are not connected to the first outerelectrodes 1 as shown in FIG. 9A.

Also in the multilayer ceramic capacitor 10B shown in FIGS. 9A and 9B,the first inner electrodes 13 a include no extended portions thatprotrude in the width direction W for connection to the first outerelectrodes 1, and the second inner electrodes 13 b include no extendedportions that protrude in the width direction W for connection to thesecond outer electrodes 2.

Third Modification

FIG. 10A is a sectional view of a multilayer ceramic capacitor 10Caccording to a preferred embodiment of the present invention in whichthe first outer electrodes 1 and the second outer electrodes 2 arealternately disposed on the first side surface 17 a, the second sidesurface 17 b, the first end surface 15 a, and the second end surface 15b of the multilayer body 11, taken along a plane including one of thefirst inner electrodes 13 a. FIG. 10B is a sectional view thereof takenalong a plane including one of the second inner electrodes 13 b. InFIGS. 10A and 10B, each margin portion 23 is shown as a single layer butmay include margin layers.

Three of the first outer electrodes 1 and two of the second outerelectrodes 2 are alternately disposed on the first side surface 17 a.Three of the second outer electrodes 2 and two of the first outerelectrodes 1 are alternately disposed on the second side surface 17 b.One of the first outer electrodes 1 and one of the second outerelectrodes 2 are disposed on the first end surface 15 a. One of thefirst outer electrodes 1 and one of the second outer electrodes 2 aredisposed on the second end surface 15 b.

As shown in FIGS. 10A and 10B, the first outer electrodes 1 that aredisposed on the first side surface 17 a and the second side surface 17 bof the multilayer body 11 include the respective surface portions 1 athat are located on the surfaces of the multilayer body 11 and therespective through sections 1 b that extend through the margin portions23. As shown in FIGS. 10A and 10B, the second outer electrodes 2 thatare disposed on the first side surface 17 a and the second side surface17 b of the multilayer body 11 include the respective surface portions 2a that are located on the surfaces of the multilayer body 11 and therespective through sections 2 b that extend through the margin portions23.

As shown in FIG. 10A, each first inner electrode 13 a has the notches 40that overlap connections between the second inner electrodes 13 b andthe second outer electrodes 2 in the stacking direction T. As shown inFIG. 10B, each second inner electrode 13 b has the notches 40 thatoverlap connections between the first inner electrodes 13 a and thefirst outer electrodes 1 in the stacking direction T.

With the above structure, the first outer electrodes 1 are connected tothe first inner electrodes 13 a as shown in FIG. 10A but are notconnected to the second inner electrodes 13 b as shown in FIG. 10B. Thesecond outer electrodes 2 are connected to the second inner electrodes13 b as shown in FIG. 10B but are not connected to the first outerelectrodes 1 as shown in FIG. 10A.

Also in the multilayer ceramic capacitor 10C shown in FIGS. 10A and 10B,the first inner electrodes 13 a include no extended portions thatprotrude in the width direction W for connection to the first outerelectrodes 1, and the second inner electrodes 13 b include no extendedportions that protrude in the width direction W for connection to thesecond outer electrodes 2.

Fourth Modification

FIG. 11A is a sectional view of a multilayer ceramic capacitor 10Daccording to a preferred embodiment of the present invention in whichthe first outer electrodes 1 and the second outer electrode 2 aredisposed on only the first side surface 17 a, of the first side surface17 a and the second side surface 17 b of the multilayer body 11, takenalong a plane including one of the first inner electrodes 13 a. FIG. 11Bis a sectional view thereof taken along a plane including one of thesecond inner electrodes 13 b. FIGS. 11A and 11B, each margin portion 23is shown as a single layer but may include margin layers. The firstouter electrodes 1 and the second outer electrode 2 may be disposed ononly the second side surface 17 b of the multilayer body 11.

Two of the first outer electrodes 1 and the single second outerelectrode 2 that is located between the two first outer electrodes 1 aredisposed on the first side surface 17 a.

As shown in FIGS. 11A and 11B, the first outer electrodes 1 include therespective surface portions 1 a that are located on the surface of themultilayer body 11 and the respective through sections 1 b that extendthrough one of the margin portions 23, and the second outer electrode 2includes the surface portion 2 a that is located on the surface of themultilayer body 11 and the through section 2 b that extends through theone of the margin portions 23.

As shown in FIG. 11A, each first inner electrode 13 a has the notch 40that overlaps connections between the second inner electrodes 13 b andthe second outer electrode 2 in the stacking direction T. As shown inFIG. 11B, each second inner electrode 13 b has the notches 40 thatoverlap connections between the first inner electrodes 13 a and thefirst outer electrodes 1 in the stacking direction T.

With the above structure, the first outer electrodes 1 are connected tothe first inner electrodes 13 a as shown in FIG. 11A but are notconnected to the second inner electrodes 13 b as shown in FIG. 11B. Thesecond outer electrode 2 is connected to the second inner electrodes 13b as shown in FIG. 11B but is not connected to the first outerelectrodes 1 as shown in FIG. 11A.

Also in the multilayer ceramic capacitor 10D shown in FIGS. 11A and 11B,the first inner electrodes 13 a include no extended portions thatprotrude in the width direction W for connection to the first outerelectrodes 1, and the second inner electrodes 13 b include no extendedportions that protrude in the width direction W for connection to thesecond outer electrode 2.

Fifth Modification

FIG. 12A is a sectional view of a multilayer ceramic capacitor 10Eaccording to a preferred embodiment of the present invention in whichthe first outer electrodes 1 are disposed on the first side surface 17a, the second side surface 17 b, the first end surface 15 a, and thesecond end surface 15 b of the multilayer body 11, and the second outerelectrodes 2 are disposed on the first side surface 17 a and the secondside surface 17 b, taken along a plane including one of the first innerelectrodes 13 a. FIG. 12B is a sectional view thereof taken along aplane including one of the second inner electrodes 13 b. FIGS. 12A and12B, each margin portion 23 is shown as a single layer but may includemargin layers.

Two of the first outer electrodes 1 and two of the second outerelectrodes 2 are alternately disposed on the first side surface 17 a.Two of the first outer electrodes 1 and two of the second outerelectrodes 2 are alternately disposed on the second side surface 17 b ofthe multilayer body 11. One of the first outer electrodes 1 is disposedon the first end surface 15 a, and the other first outer electrode isdisposed on the second end surface 15 b.

As shown in FIGS. 12A and 12B, the first outer electrodes 1 that aredisposed on the first side surface 17 a and the second side surface 17 bof the multilayer body 11 include the respective surface portions 1 athat are located on the surfaces of the multilayer body 11 and therespective through sections 1 b that extend through the margin portions23. As shown in FIGS. 12A and 12B, the second outer electrodes 2 thatare disposed on the first side surface 17 a and the second side surface17 b of the multilayer body 11 include the respective surface portions 2a that are located on the surfaces of the multilayer body 11 and therespective through sections 2 b that extend through the margin portions23.

As shown in FIG. 12A, each first inner electrode 13 a has the notches 40that overlap connections between the second inner electrodes 13 b andthe second outer electrodes 2 in the stacking direction T. As shown inFIG. 12B, each second inner electrode 13 b has the notches 40 thatoverlap connections between the first inner electrodes 13 a and thefirst outer electrodes 1 in the stacking direction T.

With the above structure, the first outer electrodes 1 are connected tothe first inner electrodes 13 a as shown in FIG. 12A but are notconnected to the second inner electrodes 13 b as shown in FIG. 12B. Thesecond outer electrodes 2 are connected to the second inner electrodes13 b as shown in FIG. 12B but are not connected to the first innerelectrodes 13 a as shown in FIG. 12A.

In the multilayer ceramic capacitor 10E shown in FIGS. 12A and 12B, thefirst inner electrodes 13 a include no extended portions that protrudein the width direction W for connection to the first outer electrodes 1,and the second inner electrodes 13 b include no extended portions thatprotrude in the width direction W for connection to the second outerelectrodes 2.

The present invention is not limited to the above-described preferredembodiments. Various applications and additional modifications can bemade within the scope of the present invention.

For example, in the above multilayer ceramic capacitor 10, each throughsection 2 b of the second outer electrodes 2 may have a dimension nearthe inner layer portion 21 in the length direction L that is smallerthan those near the first side surface 17 a and the second side surface17 b. Similarly, in the structures according to the first to fifthmodifications, each through section of the outer electrodes may have adimension near the inner layer portion 21 in the length direction L thatis smaller than those near the side surfaces.

In the description according to the preferred embodiments, each marginportion 23 includes the margin layers 23 a and 23 b that are stacked inthe width direction W. However, the margin portion 23 may be defined bya single layer.

In an electronic component according to preferred embodiments of thepresent invention, at least one of outer electrodes is disposed on atleast one of a first side surface or a second side surface of amultilayer body and is directly connected to inner electrodes atpositions spaced away from the at least one of the first side surface orthe second side surface toward the inside of the multilayer body, asdescribed above. Accordingly, any electronic component that has theabove structure other than the electronic components according to thepreferred embodiments corresponds to an electronic component of thepresent invention.

While a preferred embodiment of the present invention and modificationsthereof have been described above, it is to be understood thatvariations and additional modifications will be apparent to thoseskilled in the art without departing from the scope and spirit of thepresent invention. The scope of the present invention, therefore, is tobe determined solely by the following claims.

What is claimed is:
 1. An electronic component comprising: a multilayerbody including a plurality of inner electrodes and a plurality ofdielectric layers that are alternately stacked; and a plurality of outerelectrodes that are electrically connected to the plurality of innerelectrodes; wherein the multilayer body includes a first main surfaceand a second main surface that are opposite to each other in a stackingdirection, a first side surface and a second side surface that areopposite to each other in a width direction perpendicular orsubstantially perpendicular to the stacking direction, and a first endsurface and a second end surface that are opposite to each other in alength direction perpendicular or substantially perpendicular to thestacking direction and the width direction; at least one of theplurality of outer electrodes is located on at least one of the firstside surface or the second side surface of the multilayer body and isdirectly connected to the plurality of inner electrodes at positionsspaced away from the at least one of the first side surface or thesecond side surface toward an inside of the multilayer body; and the atleast one of the plurality of outer electrodes includes a portion thatoverlaps with the at least one of the first side surface or the secondside surface of the multilayer body when viewed in the width direction.2. The electronic component according to claim 1, wherein the multilayerbody includes a margin portion in which the plurality of innerelectrodes are not present when a section of the multilayer bodyincluding the length direction and the width direction is viewed in thestacking direction; and each of the plurality of outer electrodesincludes a through section that extends through the margin portion andis directly connected to the plurality of inner electrodes by thethrough section.
 3. The electronic component according to claim 2,wherein the multilayer body includes an outer layer portion in which theplurality of inner electrodes are not present except for the marginportion when a section of the multilayer body including the widthdirection and the stacking direction is viewed in the length direction;and each of the plurality of outer electrodes also includes the throughsection at a height position in the stacking direction at which theouter layer portion is located.
 4. The electronic component according toclaim 3, wherein the outer layer portion is provided on two sides of aninner layer portion of the multilayer body in the stacking direction. 5.The electronic component according to claim 4, wherein the outer layerportion and the inner layer portion include a same or substantially asame dielectric material.
 6. The electronic component according to claim2, wherein a dimension of the margin portion in the width direction isno less than about 5 μm and no more than about 30 μm.
 7. The electroniccomponent according to claim 2, wherein the margin portion includesmargin layers that are stacked in the width direction.
 8. The electroniccomponent according to claim 2, wherein an average particle diameter ofa dielectric particle that is included in the plurality of dielectriclayers is larger than an average particle diameter of a dielectricparticle that is included in the margin portion.
 9. The electroniccomponent according to claim 2, wherein a mole ratio of Si to Tiincluded in an outer portion of the margin layer is larger than a moleratio of Si to Ti included in an inner portion of the margin layer. 10.The electronic component according to claim 2, wherein the plurality ofouter electrodes include at least one second outer electrode; theplurality of inner electrodes include a first inner electrode and asecond inner electrode; the first inner electrode includes a notch thatoverlaps, in the stacking direction, a connection between the secondinner electrode and the at least one second outer electrode; and eachend of the notch in the length direction is located closer to a centerof the multilayer body than each end of the through section in thelength direction.
 11. The electronic component according to claim 1,wherein the plurality of outer electrodes are located on at least one ofthe first side surface and the second side surface.
 12. The electroniccomponent according to claim 1, wherein the plurality of outerelectrodes and the plurality of inner electrodes include a commonmaterial including a dielectric material, and an amount of the commonmaterial that is included in the plurality of outer electrodes is largerthan an amount of the common material that is included in the pluralityof inner electrodes.
 13. The electronic component according to claim 1,wherein a dimension, in the width direction, of one of the plurality ofinner electrodes that is located at a central portion in the stackingdirection is larger than a dimension, in the width direction, of anotherinner electrode that is located at an outer portion in the stackingdirection.
 14. The electronic component according to claim 1, whereinthe plurality of inner electrodes include a first inner electrode and asecond inner electrode; the plurality of outer electrodes include atleast one first outer electrode that is located on at least one of thefirst end surface or the second end surface of the multilayer body andthat is electrically connected to the first inner electrode, and atleast one second outer electrode that is located on at least one of thefirst side surface or the second side surface of the multilayer body andthat is electrically connected to the second inner electrode; the secondinner electrode is not in contact with the at least one of the first endsurface or the second end surface of the multilayer body on which the atleast one first outer electrode is located; and the first innerelectrode includes a notch that overlaps, in the stacking direction, aconnection between the second inner electrode and the at least onesecond outer electrode.
 15. The electronic component according to claim14, wherein the second inner electrode includes Si and Ti; and a moleratio of Si to Ti included in an end portion of the second innerelectrode in the width direction is larger than that in a centralportion of the second inner electrode in the width direction.
 16. Theelectronic component according to claim 14, wherein the at least onefirst outer electrode is not electrically connected to the second innerelectrode; and the at least one second outer electrode is notelectrically connected to the first inner electrode.
 17. The electroniccomponent according to claim 14, wherein the first inner electrodeincludes a plurality of notches that each overlap, in the stackingdirection, a corresponding connection between the second inner electrodeand the at least one second outer electrode.